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Options on board

v     Numerous combinations of SMT and Through component pads

v     Large area for standard through-hole component assembly

v     Each SMT pad is connected to through-hole pads

v     Space provided for decoupling capacitors and pull up resistors

     click HERE for more information (PDF)

U1

PLCC

20,28,36,44,52, 60, 68, 76, 84, 62, 100

U2

TQFP 0.50 mm

32,48,84,100

U3

SOIC

0.5 mil

8 pins through 44 pins

U4

TQFP

0.65 mm

52, 64, 80

U5

TQFP

0.80 mm

32,44,54,64,

80(24 X 13)

U6

TSSOP

8 pins through 40 pins

J1

DB-9

Male or Female

J2

RJ-45

4 pins through 8 pins

Y1

HC-45

2 pin crystal